NFM31KC104R1H3_ (1206, 0.1uf, dc50v) _: packaging code reference sheet 1.scope 2.murata part no. system (ex.) 3. type & dimensions a)equivalent circuit (unit:mm) 4.rated value 5.package product specifications in this catalog are as of feb.9,2016,and are subject to change or obsolescence without notice. please consult the approval sheet before ordering. please read rating and !cautions first. chip emifil?chip 3-terminal capacitor for very large current for general specifications and test methods (operating /storage temp. range) -55 to 125 c / -55 to 125 c 20 % 6a(dc) 3.0mmax. 0.1 uf mark packaging unit (7) packaging i 1.20.3 j 0.30.2 this product specification is applied to chip emifil?chip 3-terminal capacitor for very large current used for automotive electronic equipment. (3) nominal capacitance capacitance tolerance (5) dc rated voltage rated current (ma) dc resistance 1000mmin. dc 50 v insulation resistance (1)-1 l (1)-2 w t e g l f 180mm reel embossed w8p4 3000 pcs./reel 3.20.2 1.60.2 1.30.2 0.40.3 0.3 min. (1)l/w dimensions (2)features (3)nominal capacitance (4) characteristics (5)dc rated voltage (6)electrode (7)packaging code NFM31KC104R1H3-01 1 nfm 31 kc 104 r 1h 3 l
electrical performance no specification test method 1 capacitance shown in rated value. frequency : 1 0.1khz (cap.) voltage : 1 0.2v(rms) 2 voltage : rated voltage time : 2 minutes max. 3 dc resistance measured with 100ma max. 4 withstanding voltage products shall not be damaged. test voltage : rated voltage x 300% time : 1 to 5 s charge current : 50 ma max. 5 operating temperature * shown in rated value. self-temperature rise is not included 6 storage temperature *max. operating temperature (product temperature include self-heating) is 150 except for nfm31kc104r2a3. max. operating temperature (product temperature include self-heating) is 125 only nfm31kc104r2a3. standard testing condition < unless otherwise specified > < in case of doubt > temperature : ordinary temp. / 15 c to 35 c temperature: 20 c 2 c humidity: ordinary humidity / 25 %(rh) to 85 %(rh) humidity: 60 %(rh) to 70 %(rh) atmospheric pressure: 86 kpa to 106 kpa specifications and test methods item insulation resistance(i.r.) jemcps-02218d 2
mechanical performance no specification test method 1 appearance and appearance:no defects or abnormalities. appearance:visual inspection. dimensions dimensions:within the specified dimensions. dimensions:using calipers or micrometer. 2 solderability flux : ethanol solution of rosin, 25(wt)% pre-heat : 150 10c, 60 to 90s solder : sn-3.0ag-0.5cu solder temperature : 240 3c immersion time : 3 1 s immersion and emersion rates : 25mm / s 3 resistance to meet table 1. flux : ethanol solution of rosin, 25(wt)% soldering heat table 1 pre-heat : 15010c, 60 to 90s solder : sn-3.0ag-0.5cu solder temperature : 270 5c immersion time : 10 1 s immersion and emersion rates : 25mm / s initial values : measured after heat treatment (150+0 / -10 c,1hour) and exposure in the room condition for 484 hours. then measured after exposure in the room condition for 484 hours. 4 bending strength meet table 2. it shall be soldered on the glass-epoxy substrate(100 x 40 x 1.0 mm). table 2 deflection : 1 mm keeping time : 30 s (in mm) 5 drop it shall be dropped on concrete or steel board. method : free fall height : 1m attitude from which the product is dropped : 3 directions 6 bonding strength it shall be soldered on the glass-epoxy substrate. applying force (f) : 9.8 n applying time : 30 s (in mm) 7 vibration meet table 3. it shall be soldered on the glass-epoxy substrate. table 3 oscillation frequency : 10 to 55 to 10hz for 1 minute double amplitude : 1.5 mm time : a period of 2 hours in each of 3 mutually perpendicular directions. (total 6 hours) initial values: measured after heat treatment (150+0 / -10 c, 1hour) and exposure in the room condition for 484 hours. specifications and test methods item the electrodes shall be no failure after tested. products shall be no failure after tested. electrodes shall be at least 90% covered with new solder coating. the number of time : 3 times for each direction (total 9 times) jemcps-02218d 3 4 5 r 3 4 0 f d e f l e c t i o n 4 5 p r o d u c t p r e s s u r e j i g 1 . 0 1 . 0 0 . 6 1 . 6 ( g : m m ) ? ? appearance no damaged cap. change within 7 .5% i.r. meet the initial rated value. dc resistance 0.05 ? max. appearance no damaged cap. change within 7 .5% dc resistance 0. 05 ? max. appearance no damaged capacitance meet the initial rated value. dc resistance 0. 05 ? max.
environment performance it shall be soldered on the glass-epoxy substrate. no specification test method 1 temperature cycling meet table 1. 1 cycle 1 step: minimum operating temperature +0 / -3 c / 30 +3 / -0 min 2 step : room temperature / within 3 min 3 step: maximum operating temperature +3 /-0 c / 30 +3 / -0 min 4 step : room temperature / within 3 min total of 10 cycles initial values : measured after heat treatment (150+0 / -10 c,1hour) and exposure in the room condition for 484 hours. then measured after exposure in the room if its doubt, the measuring has to be done after 1 hours curing at 150+0 / -10c and 484 hours storage. 2 humidity meet table 4. temperature: 40 2 c table 4 humidity : 90 to 95%(rh) time : 500+24 / -0 hours initial values : measured after heat treatment (150+0 / -10 c,1hour) and exposure in the room condition for 484 hours. then measured after exposure in the room condition for 484 hours if its doubt, the measuring has to be done after 1 hours curing at 150+0 / -10c and 484 hours storage. 5 heat life temperature : maximum operating temperature2c test voltage : rated voltage200%(nfm31kc***r1h3) rated voltage150%(nfm31kc***r2a3) test current: rated curret at maximum operating temperature) charge current : 50 ma max. time: 1000+48 / -0 hours initial values: nfm31kc***r1h3, measured after voltage treatment (maximum operating temperature2c, rated voltage200%, 1hour) and exposure in the room condition 484 hours. nfm31kc***r2a3, measured after voltage treatment (maximum operating temperature 2 c, rated voltage 150%, 1hour) and exposure in the room condition 484 hours. then measured after exposure in the room condition for 48 4 hours. specifications and test methods item jemcps-02218d 4 appearance no damaged cap. change within 12 .5% i.r. 50m ? min. dc resistance 0 .05 ? max.
1. appearance and dimensions (8mm-wide plastic tape) (in mm) 2. specification of taping (1) packing quantity (standard quantity) 3000 pcs. / reel (2) packing method products shall be packaged in the cavity of plastic tape and sealed cover tape. (3) sprocket hole the sprocket holes are to the right as the tape is pulled toward the user. (4)cover tape cover tape has no spliced point. (5) missing components number 3. pull strength of plastic tape and cover tape 4. peeling off force of cover tape 0.2n to 0.7n (minimum value is typical) speed of peeling off : 300 mm / min 5. dimensions of leader-tape, trailer and reel there shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. (in mm) p a c k a g i n g nfm31 type missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous. the specified quantity per reel is kept. dimension of the cavity is measured at the bottom jemcpp-02233a 5 e m p t y t a p e 1 9 0 m i n . l e a d e r t r a i l e r t o p t a p e 2 . 0 0 . 5 f 1 3 . 0 0 . 2 f 2 1 . 0 0 . 8 f 1 8 0 f 6 0 9 1 3 1 . 4 1 0 0 3 d i r e c t i o n o f f e e d 2 1 0 m i n . 1 6 0 m i n . 1 0 l a b e l plastic tape 5n min. cover tape 10n min .
1. mounting density add special attention to radiating heat of products when mounting this product near the products with heating. the excessive heat by other products may cause deterioration of insulation resistance and excessive heat at this product, resulting in a fire. 2. limitation of applications (1)aircraft equipment (2)aerospace equipment (3)undersea equipment (4)power plant control equipment (5)medical equipment (6)transportation equipment(automobiles, trains, ships, etc.) (7)traffic signal equipment (8)disaster prevention / crime prevention equipment (9)data-processing equipment (10)applications of similar complexity or with reliability requirements comparable to the applications listed in the above caution please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ! jemcpc-02253a 6
this product is designed for solder mounting. please consult us in advance for applying other mounting method such as conductive adhesive. 1. flux and solder 2. note for assembling < thermal shock > pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100c max. also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100c max. 3. attention regarding p.c.b. bending the following shall be considered when designing p.c.b.'s and laying out products. (1) p.c.b. shall be designed so that products are not subject to the mechanical stress for board warpage. [products direction] products shall be located in the sideways direction (length:ac>b P d. 4. pre-heating temperature soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100c max. to avoid the heat stress for the products. 5. reflow soldering ? standard printing pattern of solder paste. 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ? for the resist and copper foil pattern, use standard land dimensions. (in mm) 2) soldering conditions standard soldering profile and the limit soldering profile is as follows. the excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. notice jemcpc-02253a 7 4 . 4 1 . 0 2 . 5 1 . 2 2 . 6 0 . 6 standard profile l imit profile pre - heating 150 c ~ 180 c , 90s 30s heating above 220c , 30s ~ 60s above 230 c , 60s max. peak temperature 245c 3c 260 c , 10s cycle of reflow 2 times 2 times l i m i t p r o f i l e s t a n d a r d p r o f i l e 9 0 s 3 0 s 2 3 0 c 2 6 0 c 2 4 5 c 3 c 2 2 0 c 3 0 s 6 0 s 6 0 s m a x . 1 8 0 1 5 0 t e m p . t i m e . ( s ) ( c ) flux use rosin - based flux, do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). do not use water - soluble flux. other flux (except above) please contact us for details, then use. solder use sn - 3.0ag - 0.5cu solder use of sn - zn based sold er will deteriorate performance of products. in case of using sn - zn based solder, please contact murata in advance. p o o r e x a m p l e g o o d e x a m p l e b a s e a m s l i t a d b c b a l e n g t h : a ? b
6. flow soldering 1)printing of adhesive adhesive amount shall be about 0.06mg per chip to obtain enough adhesive strength. the adhesive position is as follows. 2)soldering conditions standard soldering profile and the limit soldering profile is as follows. 7. reworking with soldering iron the following conditions shall be strictly followed when using a soldering iron. ? pre-heating : 150c, 1 minute ? soldering iron output : 30w max. ? tip temperature : 350c max. ? tip diameter : 3mm max. ? soldering time : 3(+1,-0) s ? times : 2times max. note: do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 8. solder volume solder shall be used not to be exceeded as shown below. accordingly increasing the solder volume, the mechanical stress to product is also increased. excessive solder volume may cause the failure of mechanical or electrical performance. 9. cleaning conditions products shall be cleaned on the following conditions. (1) cleaning temperature shall be limited to 60c max. (40c max. for isopropyl alcohol (ipa)) (2) ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and p.c.b. power : 20w / l max. frequency : 28khz to 40khz time : 5 minutes max. (3) cleaner 1. cleaner isopropyl alcohol (ipa) 2. aqueous agent pine alpha st-100s (4) there shall be no residual flux and residual cleaner after cleaning. in the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) other cleaning please contact us. 10. operating environment do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. notice the excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. jemcpc-02253a 8 u p p e r l i m i t r e c o m m e n d a b l e 1 / 3 t ? t ? t ( t : c h i p t h i c k n e s s ) t r e c o m m e n d a b l e u p p e r l i m i t a d h e s i v e p o s i t i o n o f a d h e s i v e 2 6 5 c 3 c 2 5 0 c 6 0 s m i n . 1 5 0 l i m i t p r o f i l e t i m e . ( s ) ( c ) t e m p . h e a t i n g t i m e s t a n d a r d p r o f i l e standard profile limit profile pre - heating 150 c , 60s min. heating 250 c , 4s ~ 6s 265 c 3 c, 5s max. cycle of reflow 2 times 2 times
11. resin coating the capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. so please pay your careful attention when you select resin. in prior to use, please make the reliability evaluation with the product mounted in your application set. 12. handling of a substrate after mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. excessive mechanical stress may cause cracking in the product. bending twisting 13. standard land dimensions the chip emi filter suppresses noise by conducting the high-frequency noise element to ground. therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. for large current design, width of signal land pattern should be wider not less than 1mm per 1a (1mm/a). for example in case of 10a, signal land pattern width should be 10mm or more. (1mm/a *10a= 10mm) < standard land dimensions for reflow > < standard land dimensions for flow > ?side on which chips are mounted ?side on which chips are mounted 14. storage condition (1) storage period use the products within 12 months after delivered. solderability should be checked if this period is exceeded. (2) storage environment condition ? products should be stored in the warehouse on the following conditions. temperature: -10 to +40c humidity: 15 to 85% relative humidity no rapid change on temperature and humidity ? don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ? products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ? products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ? products should be stored under the airtight packaged condition. (3) delivery care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. notice jemcpc-02253a 9 resist small diameter thru hole 0.4 copper foil pattern 1.0 1.4 2.5 4.4 0.6 1.2 2.6 3.0 10mm or more (in case of 10a) no pattern small diameter thru hole 0.4 1.0 1.4 2.5 4.4 0.6 1.2 2.6 3.0 10mm or more (in case of 10a)
(1) please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) you are requested not to use our product deviating from the agreed specifications. (3) we consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. note ! jemcpc-02253a 10
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